Notes from last two conference calls

Folks,

Sorry for the slowness in getting these out …

March 27 teleconference

Q1: what is the process we need to follow to get the specification into shape for distribution?

A1: 1) complete the review ... disposition all draft comments

      2) create an OASIS-look-n-feel PDF

      3) put out the committee draft

< is there something of "value" that can be done with the draft at this point? >

      4) pre-solicit approval votes ... we need to get access to perhaps 20% of the membership

      5) execute an OASIS vote (a plurality of 15% of member companies must vote to accept)

      6) once approved, publish the approved standard profile

Areas for "1.1 enhancements"

1) DITA 1.2 features (key space, subject scheme)

2) non-uniform multiple instantiation

3) arrays of arrays

4) non-register information types (signals, feature lists, etc.)

ACTION ITEMS

Bob: make sure the shared review is still working, get instruction out on its use

Determine how far we'd gotten in the review comment dispositioning and report to the team

Recording replay: 
https://www147.livemeeting.com/cc/freescale/view?id=sidsc-130227

April 10 teleconference

We didn't officially convene a session, as the attendance was very low. However, we did have a interesting discussion regarding
 the (then) upcoming CIDM conference. In particular, we were curious to hear about what Magillem would be presenting there, as two of the SIDSC member companies have had interactions with Magillem.

I also said I'd find the find the wiki page inside of Freescale where we've been capturing limitations / enhancements to SIDSC and see if I can scrub it for submission to the subcommittee.
 

I'll look forward to our discussion tomorrow!

Respectfully,

Bob Beims

Chair, OASIS DITA TC Semiconductor Information Design Subcommittee (SIDSC)

Applications Engineer, Staff Principal

Freescale Semiconductor, Inc.

6501 William Cannon Drive West, MD: OE327    

Austin, TX 78735-8598

www.freescale.com

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